SERVICES & ENGINEERING SUPPORT

Engineering Services

Engineering support for RF performance testing, cable phase matching, 3D CAD data, custom cable assemblies and millimeter-wave interconnect optimization.

Contact engineering
RF performance testing

RF performance testing

Vector network analysis and RF verification for return loss, insertion loss, isolation and repeatable interconnect performance.

Cable phase matching

Cable phase matching

Phase matching and calibration for RF cable sets, balancing electrical length, amplitude consistency and VSWR performance.

3D CAD engineering

3D CAD engineering

Project-ready custom 3D CAD models and drawings for design review, including DWG, DXF, STL and IGES delivery formats.

Custom cable assemblies

Custom cable assemblies

Custom RF cable solutions by interface, cable type, length, strain relief and operating environment, from samples through production.

Millimeter-Wave Interconnect Optimization

Millimeter-wave RF coaxial interconnects are critical signal-path components for communications, radar, navigation and advanced RF test systems.

At short wavelengths, connector geometry, materials and assembly precision directly affect attenuation, reflections and coupling. KLT engineers impedance matching, loss control and mechanical stability as one system.

Optimized 2.92 mm millimeter-wave cable assemblies are verified across DC–40 GHz with VSWR targets up to 1.25.
2.92 mm millimeter-wave cable assembly network-analyzer result

Interconnect Solutions

From high-frequency connectors and microwave cable to system-level test support, KLT builds complete signal paths for demanding programs.

Precision RF Solutions

Precision RF interconnects combine microwave and millimeter-wave cable assemblies, RF connectors and board-level structures for radar, satellite communications, test and advanced manufacturing.

Connector and cable designs are engineered together for impedance continuity, low loss and repeatable mechanical performance.

Cable engineering and productionMaterials · cable assembly
Connector engineering and productionTermination · board-level interconnect
Test support and optimizationSimulation · verification · optimization

Mixed Interconnect Solutions

Choose RF interfaces, mechanical formats and termination options that suit the application while maintaining assembly efficiency and lead-time control.

ANY RF CONNECTOR · ANY MICROWAVE CABLE · ANY APPLICATION
RF interconnect product 1RF interconnect product 2RF interconnect product 3RF interconnect product 4RF interconnect product 5RF interconnect product 6
RF cable termination examples

Board-to-Board Interconnect Solutions

Five project-proven interconnect structures for high-frequency, high-density, multi-channel systems with varying board spacing requirements.

SMP, SSMP and WMP series board-to-board mating structure diagramSMP, SSMP and WMP series receptacles and female-to-female adaptors
01

SMP, SSMP and WMP Series Solutions

Use SMP, SSMP and WMP series products for board-to-board interconnect — high installation density, excellent vibration resistance and high operating frequency. Mount receptacles on both module panels; connect via a female-to-female adaptor in the middle.

  • Panel receptacles support flange, threaded, solder and crimp mounting
  • Suitable for high-frequency, high-density and variable board-spacing module interconnection
Touch-contact board-to-board interconnect T/R-side and antenna-side structure diagramTouch-contact board-to-board interconnect female-to-female adaptors and spring-pin products
02

Touch-Contact Solutions

For integrated antenna structures with up to 3 000 channels and spacing as small as 3.5 mm × 3.5 mm: the T/R side uses standard receptacles with a female-to-female adaptor; the antenna side integrates the SSMP‑J interface directly into the structure panel; the inner conductor contacts the antenna π‑point via spring pins.

  • Avoids thread stripping, screw breakage, tap fracture and panel deformation associated with high volumes of M3 threaded holes
  • Avoids cold solder joints and heat-induced panel deformation from soldering — ideal for ultra-high-density antenna channels
Fuzz-button with SMP and J30JM combined board-to-board interconnect application structureFuzz-button contact components
03

Fuzz-Button Solutions

Fuzz buttons are formed from gold-plated wire wound through a specialised process. They can compress axially by 10%–30% of their length; after compression, end-face spring force makes reliable electrical contact. They carry either high-frequency or low-frequency signals and can integrate multiple signal channels on a single board.

  • Combinable with SMA, 2.92 mm, SMP and SSMP RF interfaces
  • Can form high-density, mixed-signal interconnect solutions when combined with J30JM low-frequency connectors
J63A and J30JB floating board-to-board interconnect products
04

J63A / J30JB Floating Solutions

When boards require rigid hard-mate interconnection, floating plugs reduce mating difficulty and prevent connector damage from rigid alignment. Also accommodates larger board spacing, enabling plug-to-receptacle mating without an additional adaptor.

  • Supports simultaneous mating of multiple connectors
  • Reduces assembly misalignment and connector damage risk
Micro-D ConnectorsView products →
TZ series rigid-pin and slotted-receptacle multi-contact board-to-board interconnect structure
05

TZ Series Multi-Contact Board-to-Board Solutions

The TZ series uses rigid pins mated with slotted receptacles for multi-contact board-to-board signal transfer. Contact spacing is 1.27 mm × 1.27 mm; stack height is customisable to user requirements. Mating force is low and installation is straightforward. Because the contacts are rigid, simultaneous mating of multiple connectors is not recommended.

  • Available in 16-contact and 32-contact configurations — suitable for close-spacing multi-contact signal transfer
  • Customisable board spacing height; individual connector mating is more reliable
CONTACT ENGINEERING

Put your requirement in engineering hands

For standard selection, alternates, rapid prototypes or harsh-environment designs, tell us the interface, frequency, space, environment and quantity.

LOCATION25 Tangyan Road, High-tech Zone, Xi'an, Shaanxi, China
RESPONSERapid feasibility review · standard and custom support